Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.
NSN 6135-01-190-2628
NSN 5935-01-443-1376
NSN 6105-01-478-9956
NSN 6150-01-092-1191
NSN 6320-00-894-1644
NSN 5905-00-912-4442
NSN 6240-01-364-5110
NSN 6610-00-075-6194
NSN 6110-01-127-6491
NSN 4140-01-422-2226
NSN 6685-01-033-2969
NSN 5950-01-647-2620
Last Updated: 10/05/2024